Macrocell:
A semiconductor building block containing a relatively complex electronic function that can be combined through CAD with other cells to perform a complex function with less design effort than a complete "ground-up" design.
|
Majority carrier:
The mobile charge carrier (hole or electron) that predominates in a semiconductor material. When a channel is created within the silicon, the channel will normally result from a change of majority carrier.
|
Mask:
A patterned screen of any of several materials used to expose selected areas of a semiconductor covered with a light-sensitive photoresist to polymerizing light during the fabrication process.
|
Mechanical shock:
An impact-type shock test to stress die attach, wire bonds, and seal integrity, normally performed on a sample basis.
|
Metal gate:
An MOS process fabricated with a metal (usually aluminum) as the gate electrode.
|
Microcrack:
A very small crack within the metal or other material of a semiconductor device, typically not detectable using optical magnification. In the metallization area, microcracks most typically occur at contact steps. Microcracks can lead to discontinuities in the circuitry.
|
Micron(µ):
A unit of length. 106µ= 1 m (meter). [Note: µ as a symbol of length should not be confused with µ used as a prefix to indicate microunits, such as µA (microamps) or µV microvolts). A micron is one micrometer.]
|
Mixed Signal ASIC
An Application Specific Integrated Circuit (ASIC), that contains both analog and digital circuits
|
Moisture resistance:
Subjection of sample devices to a cycle of high humidity and temperature stresses to determine the ability of these devices to survive under severe environmental conditions. This is normally performed on a sample basis with 10 cycles of 24-hour duration.
|
Molded device:
A device which is completely encapsulated in epoxy or an alternate molding compound, that is, with no internal cavity.
|
Monolithic device:
A device whose circuitry is completed contained on a single die or chip.
|
MSI:
Medium Scale Integratio - MSI devices are generally accepted to be those that contain 12 or more gate equivalents, but less than 100.
|
MSL
Moisture Sensitivity Level relates to the packaging and handling precautions for some semiconductors. The MSL is an electronic standard for the time period in which a moisture sensitive device can be exposed to ambient room conditions (approximately 30°C/60%RH).
|
MTBF:
Mean Time Between Failure - The average number of operating hours after a device has failed that would pass before the next device failure would be expected to occur.
|