IC:
Abbreviation for integrated circuit.

Implementation date:
The date by which a new military document or a new revision of an existing document must be implemented by those to whom its requirements apply. This date may be different than and later than the effectivity date.

Ingot:
A cylindrical piece of semiconductor material from which individual wafers will subsequently be sliced.

Inspection:
Actual performance of a screening step, as opposed to surveillance.

Insulating layer:
A dielectric layer used to isolate multilevel conductive and resistive material or to protect top level conductive resistive material .

Integrated circuit:
A semiconductor or semiconductor die containing multiple elements (which may be located on the die or on a hybrid substrate) which act together to form the completed device circuit.

Interconnect:
The metallization connecting two or more active elements on the surface of a die; also, the wires connecting the die to the package leads.