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IC: Abbreviation for integrated circuit.
Implementation date: The date by which a new military document or a new revision of an existing document must be implemented by those to whom its requirements apply. This date may be different than and later than the effectivity date.
Ingot: A cylindrical piece of semiconductor material from which individual wafers will subsequently be sliced.
Inspection: Actual performance of a screening step, as opposed to surveillance.
Insulating layer: A dielectric layer used to isolate multilevel conductive and resistive material or to protect top level conductive resistive material .
Integrated circuit: A semiconductor or semiconductor die containing multiple elements (which may be located on the die or on a hybrid substrate) which act together to form the completed device circuit.
Interconnect: The metallization connecting two or more active elements on the surface of a die; also, the wires connecting the die to the package leads.